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| MCP6L01/1R/1U/2/4 1 MHz, 85 A Op Amps Features * * * * * * * Available in SC-70-5 and SOT-23-5 packages Gain Bandwidth Product: 1 MHz (typical) Rail-to-Rail Input/Output Supply Voltage: 1.8V to 6.0V Supply Current: IQ = 85 A/amplifier (typical) Extended Temperature Range: -40C to +125C Available in Single, Dual and Quad Packages Description The Microchip Technology Inc. MCP6L01/1R/1U/2/4 family of operational amplifiers (op amps) supports general-purpose applications. The combination of railto-rail input and output, low quiescent current and bandwidth fit into many applications. This family has a 1 MHz Gain Bandwidth Product (GBWP) and a low 85 A per amplifier quiescent current. These op amps operate on supply voltages between 1.8V and 6.0V, with rail-to-rail input and output swing. They are available in the extended temperature range. Typical Applications * * * * * Portable Equipment Photodiode Amplifier Analog Filters Notebooks and PDAs Battery-Powered Systems Package Types MCP6L01 SC-70-5, SOT-23-5 VOUT 1 5 VDD 4 VIN- VSS 2 VIN+ 3 MCP6L02 SOIC, MSOP VOUTA 1 VINA- 2 VINA+ 3 VSS 4 8 VDD 7 VOUTB 6 VINB- 5 VINB+ Design Aids * Software * Microchip Advanced Part Selector (MAPS) * Analog Demonstration and Evaluation Boards * Application Notes FilterLab(R) MCP6L01R SOT-23-5 VOUT 1 5 VSS 4 VIN- VDD 2 MCP6L04 SOIC, TSSOP VOUTA 1 VINA- 2 VINA+ 3 VDD 4 VINB+ 5 VINB- 6 VOUTB 7 14 VOUTD 13 VIND- 12 VIND+ 11 VSS 10 VINC+ 9 VINC- 8 VOUTC Typical Application R1 VIN R3 VREF MCP6L01 Inverting Amplifier R2 VOUT VIN+ 3 MCP6L01U SOT-23-5 VIN+ 1 VSS 2 VIN- 3 4 VOUT 5 VDD (c) 2009 Microchip Technology Inc. DS22140A-page 1 MCP6L01/1R/1U/2/4 NOTES: DS22140A-page 2 (c) 2009 Microchip Technology Inc. MCP6L01/1R/1U/2/4 1.0 1.1 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Notice: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. See Section 4.1.2 "Input Voltage and Current Limits". VDD - VSS .......................................................................7.0V Current at Input Pins ....................................................2 mA Analog Inputs (VIN+, VIN-) ....... VSS - 1.0V to VDD + 1.0V All Inputs and Outputs ................... VSS - 0.3V to VDD + 0.3V Difference Input voltage ...................................... |VDD - VSS| Output Short Circuit Current ................................ Continuous Current at Output and Supply Pins ..........................150 mA Storage Temperature ...................................-65C to +150C Max. Junction Temperature ........................................ +150C ESD protection on all pins (HBM, MM) ................ 4 kV, 200V 1.2 Specifications DC ELECTRICAL SPECIFICATIONS TABLE 1-1: Electrical Characteristics: Unless otherwise indicated, TA = +25C, VDD = 5.0V, VSS = GND, VCM = VSS, VOUT VDD/2, VL = VDD/2, and RL = 10 k to VL (refer to Figure 1-1). Parameters Input Offset Input Offset Voltage Input Offset Voltage Drift Power Supply Rejection Ratio Input Current and Impedance Input Bias Current Across Temperature Across Temperature Input Offset Current Common Mode Input Impedance Differential Input Impedance Common Mode Common-Mode Input Voltage Range Common-Mode Rejection Ratio Open Loop Gain DC Open Loop Gain (large signal) Output Maximum Output Voltage Swing Output Short Circuit Current Power Supply Supply Voltage Quiescent Current per Amplifier Note 1: Sym Min (Note 1) -5 -- -- -- -- -- -- -- -- -0.3 -- -- -- 4.965 -- 1.8 30 Typ Max (Note 1) +5 -- -- -- -- -- -- -- -- 5.3 -- -- 0.035 -- -- 6.0 170 Units Conditions VOS VOS/TA PSRR IB IB IB IOS ZCM ZDIFF VCMR CMRR AOL VOL VOH ISC VDD IQ 1 2 83 2 80 2,000 1 1013||5 1013||2 -- 78 105 -- -- 20 -- 85 mV V/C TA= -40C to+125C dB pA pA pA pA ||pF ||pF V dB dB V V mA V A IO = 0 VCM = -0.3V to 5.3V VOUT = 0.2V to 4.8V G = +2, 0.5V Input Overdrive G = +2, 0.5V Input Overdrive TA= +85C TA= +125C For design guidance only; not tested. (c) 2009 Microchip Technology Inc. DS22140A-page 3 MCP6L01/1R/1U/2/4 TABLE 1-2: AC ELECTRICAL SPECIFICATIONS Electrical Characteristics: Unless otherwise indicated, TA = 25C, VDD = +5.0V, VSS = GND, VCM = VSS, VOUT VDD/2, VL = VDD/2, RL = 10 k to VL and CL = 60 pF (refer to Figure 1-1). Parameters AC Response Gain Bandwidth Product Phase Margin Slew Rate Noise Input Noise Voltage Input Noise Voltage Density Input Noise Current Density Sym GBWP PM SR Eni eni ini Min -- -- -- -- -- -- Typ 1.0 90 0.6 6 24 4 Max -- -- -- -- -- -- Units MHz V/s VP-P fA/Hz G = +1 Conditions f = 0.1 Hz to 10 Hz f = 1 kHz nV/Hz f = 10 kHz TABLE 1-3: TEMPERATURE SPECIFICATIONS Sym TA TA TA JA JA JA JA JA JA Electrical Characteristics: Unless otherwise indicated, all limits are specified for: VDD = +1.8V to +6.0V, VSS = GND. Parameters Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, 5L-SC70 Thermal Resistance, 5L-SOT-23 Thermal Resistance, 8L-SOIC (150 mil) Thermal Resistance, 8L-MSOP Thermal Resistance, 14L-SOIC Thermal Resistance, 14L-TSSOP Note 1: Min -40 -40 -65 Typ -- -- -- Max +125 +125 +150 Units C C C (Note 1) Conditions -- -- -- -- -- -- 331 256 163 206 120 100 -- -- -- -- -- -- C/W C/W C/W C/W C/W C/W Operation must not cause TJ to exceed Maximum Junction Temperature specification (150C). 1.3 Test Circuit CF 6.8 pF RG 100 k VP VIN+ MCP6L0X VIN- VM RG 100 k RF 100 k CF 6.8 pF RL 10 k VOUT CL 60 pF CB1 100 nF RF 100 k VDD VDD/2 The circuit used for most DC and AC tests is shown in Figure 1-1. This circuit can independently set VCM and VOUT; see Equation 1-1. Note that VCM is not the circuit's common mode voltage ((VP + VM)/2), and that VOST includes VOS plus the effects (on the input offset error, VOST) of temperature, CMRR, PSRR and AOL. EQUATION 1-1: G DM = R F R G V CM = ( V P + V DD 2 ) 2 V OST = V IN- - V IN+ V OUT = ( V DD 2 ) + ( V P - V M ) + V OST ( 1 + G DM ) Where: GDM = Differential Mode Gain VCM = Op Amp's Common Mode Input Voltage VOST = Op Amp's Total Input Offset Voltage (V/V) (V) (mV) CB2 1 F VL FIGURE 1-1: AC and DC Test Circuit for Most Specifications. DS22140A-page 4 (c) 2009 Microchip Technology Inc. MCP6L01/1R/1U/2/4 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, TA = +25C, VDD = 5.0V, VSS = GND, VCM = VSS, VOUT = VDD/2, VL = VDD/2, RL = 10 k to VL and CL = 60 pF. 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 -0.4 -0.2 0.0 Input Offset Voltage (mV) Common Mode Range (V) VDD = 1.8V Representative Part -40C +25C +85C +125C 0.6 0.4 0.2 0.0 -0.2 VCMRL - VSS One Wafer Lot VCMRH - VDD -0.4 -0.6 -50 -25 0 25 50 75 Ambient Temperature (C) 100 125 0.2 0.8 1.4 2.0 0.4 0.6 1.0 1.2 1.6 1.8 Common Mode Input Voltage (V) FIGURE 2-1: Input Offset Voltage vs. Common Mode Input Voltage at VDD = 1.8V. 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 2.2 FIGURE 2-4: Input Common Mode Range Voltage vs. Ambient Temperature. 100 CMRR, PSRR (dB) Input Offset Voltage (mV) VDD = 5.5V Representative Part -40C +25C +85C +125C 95 90 85 80 75 70 -50 -25 0 25 50 75 Ambient Temperature (C) 100 125 CMRR (VCMRL to VCMRH) PSRR (VCM = VSS) -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Common Mode Input Voltage (V) 6.0 FIGURE 2-2: Input Offset Voltage vs. Common Mode Input Voltage at VDD = 5.5V. -0.50 Input Offset Voltage (mV) -0.60 -0.70 -0.80 -0.90 -1.00 -1.10 -1.20 -1.30 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Output Voltage (V) VDD = 5.5V VDD = 1.8V FIGURE 2-5: Temperature. 100 90 CMRR, PSRR (dB) 80 70 CMRR, PSRR vs. Ambient Representative Part PSRR+ 60 50 40 30 20 10 1.E+01 100 1.E+02 1k 10k 1.E+03 1.E+04 Frequency (Hz) 100k 1.E+05 PSRR- CMRR FIGURE 2-3: Output Voltage. Input Offset Voltage vs. FIGURE 2-6: Frequency. CMRR, PSRR vs. (c) 2009 Microchip Technology Inc. DS22140A-page 5 MCP6L01/1R/1U/2/4 Note: Unless otherwise indicated, TA = +25C, VDD = +5.0V, VSS = GND, VCM = VSS, VOUT = VDD/2, VL = VDD/2, RL = 10 k to VL and CL = 60 pF. 1.E-02 10m 1m 1.E-03 100 1.E-04 10 1.E-05 1 1.E-06 100n 1.E-07 10n 1.E-08 1n 1.E-09 100p 1.E-10 10p 1.E-11 1p 1.E-12 6 Input, Output Voltages (V) 5 4 3 2 1 0 -1 0.E+00 1.E-05 2.E-05 3.E-05 Input Current Magnitude (A) VIN VOUT G = +2 V/V +125C +85C +25C -40C -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0 Input Voltage (V) 4.E-05 5.E-05 6.E-05 7.E-05 8.E-05 9.E-05 1.E-04 Time (10 s/div) FIGURE 2-7: Measured Input Current vs. Input Voltage (below VSS). 120 Open-Loop Gain (dB) 100 80 60 40 20 0 Gain Phase FIGURE 2-10: The MCP6L01/1R/1U/2/4 Show No Phase Reversal. 180 160 0 Open-Loop Phase () Quiescent Current per amplifier (A) -30 -60 -90 -120 -150 -180 140 120 100 80 60 40 20 0 +125 C +85C +25C 40C -20 -210 0.1 1 10 100 1k 10k 1.E+ 1M 1.E+ 1.E- 1.E+ 1.E+ 1.E+ 1.E+ 1.E+ 100k 1.E+ 10M 01 00 01 Frequency 04 05 06 07 02 03 (Hz) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Power Supply Voltage (V) FIGURE 2-8: Frequency. 1,000 Input Noise Voltage Density (nV/Hz) Open-Loop Gain, Phase vs. FIGURE 2-11: Quiescent Current vs. Power Supply Voltage. 30 25 20 15 10 5 0 -5 -10 -15 -20 -25 -30 Short Circuit Current (mA) 100 -40C +25C +85C +125C 10 0.1 1 10 100 1k 10k 100k 1.E-01 1.E+0 1.E+0 1.E+0 1.E+0 1.E+0 1.E+0 0 1 Frequency (Hz) 2 3 4 5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Power Supply Voltage (V) FIGURE 2-9: vs. Frequency. Input Noise Voltage Density FIGURE 2-12: Output Short Circuit Current vs. Power Supply Voltage. DS22140A-page 6 (c) 2009 Microchip Technology Inc. MCP6L01/1R/1U/2/4 Note: Unless otherwise indicated, TA = +25C, VDD = +5.0V, VSS = GND, VCM = VSS, VOUT = VDD/2, VL = VDD/2, RL = 10 k to VL and CL = 60 pF. 50 45 40 35 30 25 20 15 10 5 0 100 1.E-04 VDD - VOH IOUT VOL - VSS -IOUT 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 Ratio of Output Headroom to Output Current (mV/mA) VDD = 5.5V Falling Edge Slew Rate (V/s) VDD = 1.8V Rising Edge 1m 1.E-03 Output Current Magnitude (A) 10m 1.E-02 -50 -25 0 25 50 75 100 125 Ambient Temperature (C) FIGURE 2-13: Ratio of Output Voltage Headroom to Output Current vs. Output Current. 0.08 FIGURE 2-16: Temperature. Slew Rate vs. Ambient Output Voltage (20 mV/div) 0.06 Output Voltage Swing (V P-P ) G = +1 V/V 10 VDD = 5.5V 0.04 0.02 VDD = 1.8V 0.00 1 -0.02 -0.04 -0.06 -0.08 0.E+00 1.E-06 2.E-06 3.E-06 4.E-06 5.E-06 6.E-06 7.E-06 8.E-06 9.E-06 1.E-05 0.1 1k 1.E+03 Time (1 s/div) 10k 100k 1.E+04 1.E+05 Frequency (Hz) 1M 1.E+06 FIGURE 2-14: Pulse Response. Small Signal, Non-Inverting FIGURE 2-17: Frequency. Output Voltage Swing vs. 5.0 4.5 Output Voltage (V) 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0.E+00 1.E-05 2.E-05 3.E-05 4.E-05 5.E-05 6.E-05 7.E-05 8.E-05 G = +1 V/V 9.E-05 1.E-04 Time (10 s/div) FIGURE 2-15: Pulse Response. Large Signal, Non-Inverting (c) 2009 Microchip Technology Inc. DS22140A-page 7 MCP6L01/1R/1U/2/4 NOTES: DS22140A-page 8 (c) 2009 Microchip Technology Inc. MCP6L01/1R/1U/2/4 3.0 PIN DESCRIPTIONS Descriptions of the pins are listed in Table 3-1. TABLE 3-1: MCP6L01 SC-70-5, SOT-23-5 1 4 3 5 -- -- -- -- -- -- 2 -- -- -- -- PIN FUNCTION TABLE MCP6L01R SOT-23-5 1 4 3 2 -- -- -- -- -- -- 5 -- -- -- -- MCP6L01U SOT-23-5 4 3 1 5 -- -- -- -- -- -- 2 -- -- -- -- MCP6L02 SOIC-8, MSOP-8 1 2 3 8 5 6 7 -- -- -- 4 -- -- -- -- MCP6L04 SOIC-14, TSSOP-14 1 2 3 4 5 6 7 8 9 10 11 12 13 14 -- Symbol VOUT, VOUTA VIN-, VINA- VIN+, VINA+ VDD VINB+ VINB- VOUTB VOUTC VINC- VINC+ VSS VIND+ VIND- VOUTD NC Description Output (op amp A) Inverting Input (op amp A) Non-inverting Input (op amp A) Positive Power Supply Non-inverting Input (op amp B) Inverting Input (op amp B) Output (op amp B) Output (op amp C) Inverting Input (op amp C) Non-inverting Input (op amp C) Negative Power Supply Non-inverting Input (op amp D) Inverting Input (op amp D) Output (op amp D) No Internal Connection 3.1 Analog Outputs 3.3 Power Supply Pins The analog output pins (VOUT) are low-impedance voltage sources. The positive power supply (VDD) is 1.8V to 6.0V higher than the negative power supply (VSS). For normal operation, the other pins are between VSS and VDD. Typically, these parts are used in a single (positive) supply configuration. In this case, VSS is connected to ground and VDD is connected to the supply. VDD will need bypass capacitors. 3.2 Analog Inputs The non-inverting and inverting inputs (VIN+, VIN-, ...) are high-impedance CMOS inputs with low bias currents. (c) 2009 Microchip Technology Inc. DS22140A-page 9 MCP6L01/1R/1U/2/4 NOTES: DS22140A-page 10 (c) 2009 Microchip Technology Inc. MCP6L01/1R/1U/2/4 4.0 APPLICATION INFORMATION The MCP6L01/1R/1U/2/4 family of op amps is manufactured using Microchip's state of the art CMOS process. It is designed for low cost, low power and general purpose applications. The low supply voltage, low quiescent current and wide bandwidth makes the MCP6L01/1R/1U/2/4 ideal for battery-powered applications. This device has high phase margin, which makes it stable for larger capacitive load applications. A significant amount of current can flow out of the inputs (through the ESD diodes) when the common mode voltage (VCM) is below ground (VSS); see Figure 2-7. Applications that are high impedance may need to limit the usable voltage range. 4.1.3 NORMAL OPERATION 4.1 4.1.1 Rail-to-Rail Inputs PHASE REVERSAL The input stage of the MCP6L01/1R/1U/2/4 op amps use two differential CMOS input stages in parallel. One operates at low common mode input voltage (VCM), while the other operates at high VCM. WIth this topology, and at room temperature, the device operates with VCM up to 0.3V above VDD and 0.3V below VSS (typically at +25C). The transition between the two input stages occurs when VCM = VDD - 1.1V. For the best distortion and gain linearity, with non-inverting gains, avoid this region of operation. The MCP6L01/1R/1U/2/4 op amps are designed to prevent phase inversion when the input pins exceed the supply voltages. Figure 2-10 shows an input voltage exceeding both supplies without any phase reversal. 4.1.2 INPUT VOLTAGE AND CURRENT LIMITS 4.2 Rail-to-Rail Output In order to prevent damage and/or improper operation of these amplifiers, the circuit they are in must limit the currents (and voltages) at the input pins (see Section 1.1 "Absolute Maximum Ratings "). Figure 4-1 shows the recommended approach to protecting these inputs. The internal ESD diodes prevent the input pins (VIN+ and VIN-) from going too far below ground, and the resistors R1 and R2 limit the possible current drawn out of the input pins. Diodes D1 and D2 prevent the input pins (VIN+ and VIN-) from going too far above VDD, and dump any currents onto VDD. VDD D1 V1 R1 V2 R2 R3 R1 > VSS - (minimum expected V1) 2 mA VSS - (minimum expected V2) R2 > 2 mA MCP6L0X D2 The output voltage range of the MCP6L01/1R/1U/2/4 op amps is VDD - 35 mV (minimum) and VSS + 35 mV (maximum) when RL = 10 k is connected to VDD/2 and VDD = 5.0V. Refer to Figure 2-13 for more information. 4.3 Capacitive Loads Driving large capacitive loads can cause stability problems for voltage feedback op amps. As the load capacitance increases, the feedback loop's phase margin decreases and the closed-loop bandwidth is reduced. This produces gain peaking in the frequency response, with overshoot and ringing in the step response. When driving large capacitive loads with these op amps (e.g., > 100 pF when G = +1), a small series resistor at the output (RISO in Figure 4-2) improves the feedback loop's stability by making the output load resistive at higher frequencies; the bandwidth will usually be decreased. RG RF RISO VOUT CL RN MCP6L0X FIGURE 4-2: Output Resistor, RISO stabilizes large capacitive loads. Bench measurements are helpful in choosing RISO. Adjust RISO so that a small signal step response (see Figure 2-14) has reasonable overshoot (e.g., 4%). FIGURE 4-1: Inputs. Protecting the Analog (c) 2009 Microchip Technology Inc. DS22140A-page 11 MCP6L01/1R/1U/2/4 4.4 Supply Bypass Guard Ring VIN- VIN+ With this family of operational amplifiers, the power supply pin (VDD for single supply) should have a local bypass capacitor (i.e., 0.01 F to 0.1 F) within 2 mm for good high frequency performance. It also needs a bulk capacitor (i.e., 1 F or larger) within 100 mm to provide large, slow currents. This bulk capacitor can be shared with other nearby analog parts. 4.5 Unused Op Amps FIGURE 4-4: Layout. 1. Example Guard Ring An unused op amp in a quad package (e.g., MCP6L04) should be configured as shown in Figure 4-3. These circuits prevent the output from toggling and causing crosstalk. Circuit A sets the op amp at its minimum noise gain. The resistor divider produces any desired reference voltage within the output voltage range of the op amp; the op amp buffers that reference voltage. Circuit B uses the minimum number of components and operates as a comparator, but it may draw more current. 1/4 MCP6L04 (A) VDD R1 VDD VREF 1/4 MCP6L04 (B) VDD 2. Inverting Amplifiers (Figure 4-4) and Transimpedance Gain Amplifiers (convert current to voltage, such as photo detectors). a) Connect the guard ring to the non-inverting input pin (VIN+); this biases the guard ring to the same reference voltage as the op amp's input (e.g., VDD/2 or ground). b) Connect the inverting pin (VIN-) to the input with a wire that does not touch the PCB surface. Non-inverting Gain and Unity-Gain Buffer. a) Connect the guard ring to the inverting input pin (VIN-); this biases the guard ring to the common mode input voltage. b) Connect the non-inverting pin (VIN+) to the input with a wire that does not touch the PCB surface. R2 4.7 4.7.1 Application Circuit ACTIVE LOW-PASS FILTER R2 V REF = V DD -----------------R1 + R2 FIGURE 4-3: Unused Op Amps. 4.6 PCB Surface Leakage In applications where low input bias current is critical, PCB (printed circuit board) surface leakage effects need to be considered. Surface leakage is caused by humidity, dust or other contamination on the board. Under low humidity conditions, a typical resistance between nearby traces is 1012. A 5V difference would cause 5 pA of current to flow; this is greater than this family's bias current at +25C (1 pA, typical). The easiest way to reduce surface leakage is to use a guard ring around sensitive pins (or traces). The guard ring is biased at the same voltage as the sensitive pin. Figure 4-4 shows an example of this type of layout.. The MCP6L01/1R/1U/2/4 op amp's low input bias current makes it possible for the designer to use larger resistors and smaller capacitors for active low-pass filter applications. However, as the resistance increases, the noise generated also increases. Parasitic capacitances and the large value resistors could also modify the frequency response. These trade-offs need to be considered when selecting circuit elements. Figure 4-5 shows a second-order Bessel filter with 100 Hz cutoff frequency and a gain of +1 V/V. The component values were selected using Microchip's FilterLab(R) software; the capacitor values were reduced to a more common range. C1 100 pF R1 11.3 k VIN C2 68 pF R2 20.5 k MCP6L01 VOUT FIGURE 4-5: DS22140A-page 12 Bessel Filter. (c) 2009 Microchip Technology Inc. MCP6L01/1R/1U/2/4 5.0 DESIGN AIDS 5.4 Application Notes Microchip provides the basic design aids needed for the MCP6L01/1R/1U/2/4 family of op amps. The following Microchip Application Notes are available on the Microchip web site at www.microchip. com/appnotes and are recommended as supplemental reference resources. * ADN003: "Select the Right Operational Amplifier for your Filtering Circuits", DS21821 * AN722: "Operational Amplifier Topologies and DC Specifications", DS00722 * AN723: "Operational Amplifier AC Specifications and Applications", DS00723 * AN884: "Driving Capacitive Loads With Op Amps", DS00884 * AN990: "Analog Sensor Conditioning Circuits - An Overview", DS00990 5.1 FilterLab(R) Software Microchip's FilterLab(R) software is an innovative software tool that simplifies analog active filter (using op amps) design. Available at no cost from the Microchip web site at www.microchip.com/filterlab, the FilterLab design tool provides full schematic diagrams of the filter circuit with component values. It also outputs the filter circuit in SPICE format, which can be used with the macro model to simulate actual filter performance. 5.2 Microchip Advanced Part Selector (MAPS) MAPS is a software tool that helps efficiently identify Microchip devices that fit a particular design requirement. Available at no cost from the Microchip website at www.microchip.com/maps, the MAPS is an overall selection tool for Microchip's product portfolio that includes Analog, Memory, MCUs and DSCs. Using this tool, a customer can define a filter to sort features for a parametric search of devices and export side-byside technical comparison reports. Helpful links are also provided for Data sheets, Purchase and Sampling of Microchip parts. 5.3 Analog Demonstration and Evaluation Boards Microchip offers a broad spectrum of Analog Demonstration and Evaluation Boards that are designed to help customers achieve faster time to market. For a complete listing of these boards and their corresponding user's guides and technical information, visit the Microchip web site at www.microchip.com/analog tools. Some boards that are especially useful are: * * * * * * * MCP6XXX Amplifier Evaluation Board 1 MCP6XXX Amplifier Evaluation Board 2 MCP6XXX Amplifier Evaluation Board 3 MCP6XXX Amplifier Evaluation Board 4 Active Filter Demo Board Kit 5/6-Pin SOT-23 Evaluation Board, P/N VSUPEV2 8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board, P/N SOIC8EV * 14-Pin SOIC/TSSOP/DIP Evaluation Board, P/N SOIC14EV (c) 2009 Microchip Technology Inc. DS22140A-page 13 MCP6L01/1R/1U/2/4 NOTES: DS22140A-page 14 (c) 2009 Microchip Technology Inc. MCP6L01/1R/1U/2/4 6.0 6.1 PACKAGING INFORMATION Package Marking Information 5-Lead SC-70 (MCP6L01) Example: Device Code BKNN XXNN MCP6L01 BK25 Note: Applies to 5-Lead SC-70. 5-Lead SOT-23 (MCP6L01/1R/1U) 5 4 Example: Code VXNN VYNN VZNN 1 2 3 5 4 Device MCP6L01 XXNN 1 2 3 MCP6L01R MCP6L01U VX25 Note: Applies to 5-Lead SOT-23. 8-Lead SOIC (150 mil) (MCP6L02) XXXXXXXX XXXXYYWW NNN Example: MCP6L02E e3 SN^^0908 256 8-Lead MSOP (MCP6L02) XXXXXX YWWNNN Example: 6L02E 908256 Legend: XX...X Y YY WW NNN e3 * Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. (c) 2009 Microchip Technology Inc. DS22140A-page 15 MCP6L01/1R/1U/2/4 Package Marking Information 14-Lead SOIC (150 mil) (MCP6L04) Example: XXXXXXXXXX XXXXXXXXXX YYWWNNN MCP6L04 e3 E/SL^^ 0908256 14-Lead TSSOP (MCP6L04) Example: XXXXXX YYWW NNN 6L04STE 0908 256 DS22140A-page 16 (c) 2009 Microchip Technology Inc. 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DS22140A-page 19 MCP6L01/1R/1U/2/4 /HDG 3ODVWLF 0LFUR 6PDOO 2XWOLQH 3DFNDJH 06 >0623@ 1RWH )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWS ZZZ PLFURFKLS FRP SDFNDJLQJ D N E E1 NOTE 1 1 2 b A A2 c e A1 8QLWV 'LPHQVLRQ /LPLWV 1XPEHU RI 3LQV 3LWFK 2YHUDOO +HLJKW 0ROGHG 3DFNDJH 7KLFNQHVV 6WDQGRII 2YHUDOO :LGWK 0ROGHG 3DFNDJH :LGWK 2YHUDOO /HQJWK )RRW /HQJWK )RRWSULQW )RRW $QJOH /HDG 7KLFNQHVV 1 H $ $ $ ( ( ' / / I F L1 0,//,0(7(56 0,1 120 %6& %6& %6& %6& 5() 0$; L /HDG :LGWK E 1RWHV 3LQ YLVXDO LQGH[ IHDWXUH PD\ YDU\ EXW PXVW EH ORFDWHG ZLWKLQ WKH KDWFKHG DUHD 'LPHQVLRQV ' DQG ( GR QRW LQFOXGH PROG IODVK RU SURWUXVLRQV 0ROG IODVK RU SURWUXVLRQV VKDOO QRW H[FHHG 'LPHQVLRQLQJ DQG WROHUDQFLQJ SHU $60( < 0 %6& %DVLF 'LPHQVLRQ 7KHRUHWLFDOO\ H[DFW YDOXH VKRZQ ZLWKRXW WROHUDQFHV 5() 5HIHUHQFH 'LPHQVLRQ XVXDOO\ ZLWKRXW WROHUDQFH IRU LQIRUPDWLRQ SXUSRVHV RQO\ PP SHU VLGH 0LFURFKLS 7HFKQRORJ\ 'UDZLQJ & % DS22140A-page 20 (c) 2009 Microchip Technology Inc. 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DS22140A-page 21 MCP6L01/1R/1U/2/4 /HDG 3ODVWLF 6PDOO 2XWOLQH 61 1DUURZ 1RWH PP %RG\ >62,&@ )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWS ZZZ PLFURFKLS FRP SDFNDJLQJ DS22140A-page 22 (c) 2009 Microchip Technology Inc. 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DS22140A-page 23 MCP6L01/1R/1U/2/4 1RWH )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWS ZZZ PLFURFKLS FRP SDFNDJLQJ DS22140A-page 24 (c) 2009 Microchip Technology Inc. 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DS22140A-page 25 MCP6L01/1R/1U/2/4 NOTES: DS22140A-page 26 (c) 2009 Microchip Technology Inc. MCP6L01/1R/1U/2/4 APPENDIX A: REVISION HISTORY Revision A (March 2009) * Original Release of this Document. (c) 2009 Microchip Technology Inc. DS22140A-page 29 MCP6L01/1R/1U/2/4 NOTES: DS22140A-page 30 (c) 2009 Microchip Technology Inc. MCP6L01/1R/1U/2/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range /XX Package b) MCP6L01T-E/OT: Device: MCP6L01T: MCP6L01RT: MCP6L01UT: MCP6L02T: MCP6L04T: Single Op Amp (Tape and Reel) (SC-70, SOT-23) Single Op Amp (Tape and Reel) (SOT-23) Single Op Amp (Tape and Reel) (SOT-23) Dual Op Amp (Tape and Reel) (SOIC, MSOP) Quad Op Amp (Tape and Reel) (SOIC, TSSOP) Examples: a) MCP6L01T-E/LT: Tape and Reel, Extended Temperature, 5LD SC-70 package Tape and Reel, Extended Temperature, 5LD SOT-23 package a) MCP6L01RT-E/OT: Tape and Reel, Extended Temperature, 5LD SOT-23 package. a) MCP6L01UT-E/OT: Tape and Reel, Extended Temperature, 5LD SOT-23 package. a) MCP6L02T-E/MS: Tape and Reel, Extended Temperature, 8LD MSOP package. b) MCP6L02T-E/SN: Tape and Reel, Extended Temperature, 8LD SOIC package. a) MCP6L04T-E/SL: Tape and Reel, Extended Temperature, 14LD SOIC package. Tape and Reel, Extended Temperature, 14LD TSSOP package. Temperature Range: E = -40C to +125C Package: LT OT MS SN SL ST = = = = = = Plastic Package (SC-70), 5-lead (MCP6L01 only) Plastic Small Outline Transistor (SOT-23), 5-lead Plastic MSOP, 8-lead Plastic SOIC, (3.99 mm body), 8-lead Plastic SOIC (3.99 mm body), 14-lead Plastic TSSOP (4.4mm body), 14-lead b) MCP6L04T-E/ST: (c) 2008 Microchip Technology Inc. DS22140A-page 31 MCP6L01/1R/1U/2/4 NOTES: DS22140A-page 32 (c) 2008 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." * * * Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC, SmartShunt and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, nanoWatt XLP, PICkit, PICDEM, PICDEM.net, PICtail, PIC32 logo, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. (c) 2009 Microchip Technology Inc. DS22140A-page 33 Worldwide Sales and Service AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509 ASIA/PACIFIC Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 ASIA/PACIFIC India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4080 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 EUROPE Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820 02/04/09 DS22140A-page 34 (c) 2009 Microchip Technology Inc. |
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